All partners of the ORIGNEAL project have met in Wien for a kick-off meeting at TU Wien on November 27-28, 2019.
The project − supported by the European Commission within the FET-Open Programme − proposes a radically new approach to address the challenge of ultra-dense 3D integration of electronic devices. The idea is to use a thin-film-transistor technology to realize electronic devices on a thin substrate that can be mechanically folded to achieve an ultra-dense 3D packaging.
“The idea of folding 2D-circuits printed on thin foils comes from our complementary expertizes in the fields of microtechnology, flexible electronics and machine construction”, says Daniel Neumaier, project coordinator of ORIGENAL. “Achieving our goal requires that all partners interact closely and influence each other. At the kick-off meeting in Vienna we have discussed the next steps required for achieving the ambitious project goal and ended up with a constructive and efficient work plan.”