All partners of the ORIGNEAL project have met in Wien for a kick-off meeting at TU Wien on November 27-28, 2019.
![](https://www.origenal-project.eu/wp-content/uploads/2019/11/KickOffMeeting-WienNov2019-1024x661.jpg)
Origami electronics for three-dimensional integration of computational devices
All partners of the ORIGNEAL project have met in Wien for a kick-off meeting at TU Wien on November 27-28, 2019.
Experts from all over Europe gathered in Aachen to discuss the challenges of wafer-scale integration of 2D materials, in a workshop organized by AMO and the Aachen Graphene & 2D Materials Center.